mc 13141

SEMICONDUCTOR
TECHNICAL DATA
LOW POWER DC – 1.8 GHz
LNA AND MIXER
D1 SUFFIX
PLASTIC PACKAGE
CASE 751
(SO–8)
8
1
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D SUFFIX
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14
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FTB SUFFIX
PLASTIC PACKAGE
CASE 976
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20 1
MOTOROLA ANALOG IC DEVICE DATA 1







The MC13141 is intended to be used as a first amplifier and down
converter for RF applications. It features wide band operation, low noise,
high gain and high linearity while maintaining low current consumption. The
circuit consists of a Low Noise Amplifier (LNA), a Local Oscillator amplifier
(LOamp), a mixer, an Intermediate Frequency amplifier (IFamp) and a dc
control section.
• Wide RF Bandwidth: DC–1.8 GHz
• Wide Mixer Bandwidth: DC–1.8 GHz
• Wide IF Bandwidth: DC–100 MHz
• Low Power: 7.7 mA @ VCC = 2.7–6.5 V
• High Mixer Linearity: Pi1.0 dB = –2.0 dBm, IP3in = 3.0 dBm
• Linearity Adjustment Increases IP3in (Not Available in SOIC8)
Up to +20 dBm
• Single–Ended 50 W Mixer Input
• Double Balanced Mixer Operation
• Single–Ended 800 W Mixer Output
• Single–Ended 50 W LO Input
ORDERING INFORMATION
Device
Operating
Temperature Range Package
MC13141D1
T 40° 85°C
SO–8
MC13141D TA = –to +SO–14
MC13141FTB TQFP–20
PIN CONNECTIONS
VCC
LO
RFout
Enable
6
7
8
5
3
2
1
4
VEE
VCC 12
13
14
11
3
2
1
4
5 10
6 9
7 8
RFm
RFin
VEE RFm
IF
SO–8
SO–14
TQFP–20
VCC
RFin
VEE
VEE
LO IF
VCC IF
Mix Lin
Cont
VEE Mx
Enable
RFout
VEE
VEE
VEE Mx
VEE LO
VEE
VEE
RFin
Mix Lin
Cont
RFm
Enable
8
7
6
9
10
18
19
20
17
16
5 4 3 2 1
11 12 13 14 15
VCC
VEE
VCC
VCC
VEE
RFout
IF
VEE
LO
Mx Lin
Cont
VEE
Mx Lin
Cont
This device contains 161 active transistors.
This document contains information on a product under development. Motorola reserves the
right to change or discontinue this product without notice.
W Motorola, Inc. 1996 Issue 5
MC13141
2 MOTOROLA ANALOG IC DEVICE DATA
MAXIMUM RATINGS (TA = 25°C, unless otherwise noted.)
Rating Symbol Value Unit
Power Supply Voltage VCC 7.0 (max) Vdc
Operating Supply Voltage Range VCC 2.7–6.5 Vdc
ELECTRICAL CHARACTERISTICS (SOIC8 Package, VCC = 3.0 V, TA = 25°C, LOin = –10 dBm @ 950 MHz, IF @ 50 MHz.)
Characteristic Symbol Min Typ Max Unit
Supply Current (Power Down) ICC – 100 – pA
Supply Current (Power Up) ICC – 7.7 – mA
Amplifier Gain (50 W Insertion Gain) S21 – 12 – dB
Amplifier Reverse Isolation S12 – –33 – dB
Amplifier Input Match Gin amp – –10 – dB
Amplifier Output Match Gout amp – –15 – dB
Amplifier 1.0 dB Gain Compression Pin–1.0 dB – –15 – dBm
Amplifier Input Third Order Intercept IP3in – – 5.0 – dBm
Amplifier Gain @ N.F. (Application Circuit) GNF – 17 – dB
Amplifier Noise Figure (50 W) NF – 1.8 – dB
Mixer Voltage Conversion Gain (RP = RL = 800 W) VGC – 15 – dB
Mixer Power Conversion Gain (RP = RL = 800 W) PGC – 7.0 – dB
Mixer Input Match Gin M – –20 – dB
Mixer SSB Noise Figure NFSSBM – 16.0 – dB
Mixer 1.0 dB Gain Compression Pin–1.0 dBM – –10 – dBm
Mixer Input Third Order Intercept IP3inM – –3.0 – dBm
Mixer 3 dB RF Bandwidth Mx–3 dBBW – 1.8 – GHz
LO Drive Level LOIn – –10 – dBm
LO Input Match Gin LO – –20 – dB
RFin Feedthrough to RFm PRFin–RFin – –13 – dB
RFout Feedthrough to RFm PRFout–RFm – –30 – dB
LO Feedthrough to IF PLO–IF – –25 – dB
LO Feedthrough to RFin PLO–RFin – –30 – dB
LO Feedthrough to RFm PLO–RFm – –50 – dB
Mixer RF Feedthrough to IF PRFm–IF – –50 – dB
Mixer RF Feedthrough to RFin PRFm–RFin – –25 – dB
MC13141
MOTOROLA ANALOG IC DEVICE DATA 3
CIRCUIT DESCRIPTION
General
The MC13141 is a low power LNA, double–balanced
mixer. This device is designated for use as the front–end
section in analog and digital FM systems such as Digital
European Cordless Telephone (DECT), PHS, PCS, Cellular,
UHF and 800 MHz Special Mobile Radio (SMR), UHF
Family Radio Services and 902 to 928 MHz cordless
telephones. It features a mixer linearity control to preset or
auto preset or auto program the mixer dynamic range, an
enable function and buffered IF output for increased overall
gain. Further details are covered in the Pin Function
Description which shows the equivalent internal circuit and
external circuit requirements.
Current Regulation/Enable
Temperature compensating voltage independent current
regulators are controlled by the the enable function in which
“high” powers up the IC.
Low Noise Amplifier (LNA)
The LNA is internally biased at low supply current
(approximately 2.0 mA emitter current) for optimal noise
figure and gain. Input and output matching may be achieved
at various frequencies using few external components (see
Application Circuit). Matching the LNA for maximum stable
gain (MSG) yields noise performance within a few tenths of a
dB of the minimum noise figure. Typical performance at
1.0 GHz is 17 dB gain and 1.8 dB noise figure for Vcc at
3.0 to 5.0 Vdc.
Mixer
The mixer is a double–balanced four quadrant multiplier
biased class AB allowing for programmable linearity control
via an external current source. An input third order intercept
point of 20 dBm may be achieved. All 3 ports of the mixer are
designed to work up to 1.8 GHz. The mixer has a 50 W
single–ended RF input and IF output buffer amplifier. The
linear gain of the mixer is approximately 7.0 dB with a SSB
noise figure of 16 dB.
Local Oscillator
It requires an external local oscillator source at –10 dBm
input level to maximize the mixer gain.
PIN FUNCTION DESCRIPTION
14 Pin
SOIC
20 Pin
TQFP Symbol
Equivalent Internal Circuit
(20 Pin TQFP)
Functional Description/External
Circuit Requirements
4 6 RFin
RFout
1
Vref1
RF Input
The input is the base of an NPN low noise amplifier.
Minimum external matching is required to optimize the
input return loss and gain.
2, 3 4, 5 VCC
RFin
6
VEE
2, 3, 7
VEE Vref2
2.0 mA
VCC – Positive Supply Voltage
Two VCC pins are provided for the Local Oscillator and LO
Buffer Amplifier. The operating supply voltage range is
from 2.7 Vdc to 6.5 Vdc. In the PCB layout, the VCC trace
must be kept as wide as feasible to minimize inductive
reactances along the trace. VCC should be decoupled to
VEE at the IC pin as shown in the component placement
view.
1, 5 2, 3, 7
and 8
VEE
VCC
4, 5
VEE – Negative Supply
VEE pin is taken to an ample dc ground plane through a
low impedance path. The path should be kept as short as
possible. A two sided PCB is implemented so that ground
returns can be easily made through via holes.
14 1 RFout
VEE
8 RF Output
The output is from the collector of the LNA. As shown in
the 926 MHz application receiver the output is conjugately
matched with a shunt L, and series L and C network.
7 11 LO
LO
11
Vref3
33
33
Local Oscillator Input
50 W single–ended buffered LO input.
MC13141
4 MOTOROLA ANALOG IC DEVICE DATA
PIN FUNCTION DESCRIPTION (continued)
14 Pin
SOIC
Functional Description/External
Circuit Requirements
Equivalent Internal Circuit
Symbol (20 Pin TQFP)
20 Pin
TQFP
5, 6 9, 10,
12, 14
VEE
13
Vref2 = 2.0 Vbe
VCC
800
VEE – Negative Supply
These pins are VEE supply for the IF and LO. In the
application PC board these pins are tied to a common
VEE trace with other VEE pins.
8 13 IF IF
VEE
9, 10,
12, 14
IF Output
The IF is a 800 W single–ended output which must be
externally matched to 50 W for optimal performance.
10 16 RFm
Vref4
VCC Mixer RF Input
The mixer input impedance is broadband 50 W for
applications up to 1.8 GHz. It easily interfaces with a RF
ceramic filter as shown in the application schematic. The
pin dc bias is set at 1.0 Vbe.
11 17 Mix Lin
Cont
RFm
16
Mix Lin
Cont
17
33
33
VEE Mixer Linearity Control
The mixer linearity control circuit accepts approximately
0 to 2.3 mA control current to set the dynamic range of the
mixer. An Input Third Order Intercept Point, IIP3 of
20 dBm may be achieved at 2.3 mA of control current
(approximately 7.0 mA of additional supply current). The
pin dc bias is set at 2.0 Vbe.
12 18, 19 VEE
400 mA
VEE – Negative Supply
These pins are VEE supply for the mixer input.
13 20 EN
VCC
EN
20 40 k
2.0 Vbe
+
–
Enable
The device is enabled by pulling up to VCC or greater than
2.0 Vbe.
APPLICATIONS INFORMATION
Evaluation PC Board
The evaluation PCB is very versatile and is intended to be
used across the entire useful frequency range of this device.
The PC board accommodates all SMT components on the
circuit side (see Circuit Side Component Placement View).
This evaluation board will be discussed and referenced in
this section.
Component Selection
The evaluation PC board is designed to accommodate
specific components, while also being versatile enough to use
components from various manufacturers and coil types. The
circuit side placement view is illustrated for the components
specified in the application circuit. The application circuit
schematic specifies particular components that were used to
achieve the results given and specified in the tables but
alternate components of the same Q and value should give
similar results.
MC13141
MOTOROLA ANALOG IC DEVICE DATA 5
Figure 1. MC13141D1 Application Circuit (881.5 MHZ)
RF 100 n
Input
16 p
SMA
1
2
3
4
100 p
SMA
LO Input
798.5 MHz
LNA
Mixer
8
7
6
5
MC13141D
6.8 nH
RF
Filter
0.9 p
470 nH
Enable
VCC
1000 p
10 p
IF
Output
91 p
100 p
881.5 MHz
83.161 MHz
ZO = 50 W
*ZO =
50 W
ZO =
50 W
NOTE: *50 W Microstrip Transmission Line; length shown in Figure 2.
Figure 2. Circuit Side Component Placement View
LNA
Output
Gnd
VCC
LNA
Input
LO
Input
IF
Output
Mixer
Input
100 p
MC13141D1
1 n 470 nH
83.161 MHz
SAW Filter
0.9 p
100 p
10 p
100 n
91 p
6.8 nH
16 p
NOTES: 881.5 MHz SAW filter in the ceramic surface mount package is available from several sources: Siemens part # B39881–B4608–Z010 is an example.
Other suppliers include Toko and Murata.
The PCB accommodates ceramic dielectric filters for applications in Cellular, DECT, PHS and ISM bands at 902–928 and 2.4–2.5 GHz. Toko makes a
full line–up covering the above bands.
The PCB may be used without an image filter; ac couple the LNA to the mixer. Traces are provided on the PCB to evaluate the LNA and mixer
separately. The component placement view shows external circuit components used in the 881.5 MHz application circuit. It is necessary to cut a section
in the trace before placing the 0.9 pF capacitor. Capacitors should be 0805 size; the 6.8 nH inductor is a Toko type LL2012.
MC13141D1 Rev A
MC13141
6 MOTOROLA ANALOG IC DEVICE DATA
Figure 3. MC13141D Application Circuit (881.5)
100 n
1000 p
VCC
91 p
RF Input
881.5 MHz 16 p
1
2
3
4
5
6
7
Mixer
LNA
MC13141D
LO Input
798.5 MHz 100 p
SMA
Mixer
Linearity
Control
6.8 nH
10 p
470 nH SMA
VCC
8
9
10
11
12
13
14 RF
Filter
Enable
Mixer
Linearity
Control
IF Output
0.9 p
SMA
83.161 MHz
*ZO = 50 W
NOTE: *50 W Microstrip Transmission Line; length shown in Figure 4.
Figure 4. Circuit Side Component Placement View
MC13141D
Rev 0
LNA
Output
VCC
LNA
Input
LO
Input
IF
Output
Mix Lin
Cont
Mixer
Input
NOTES: 881.5 MHz SAW filter in the ceramic surface mount package is available from several sources: Siemens part # B39881–B4608–Z010 is an example.
Other suppliers include Toko and Murata.
The PCB accommodates ceramic dielectric filters for applications in Cellular, DECT, PHS and ISM bands at 902–928 and 2.4–2.5 GHz. Toko makes a
full line–up covering the above bands.
The PCB may be used without an image filter; ac couple the LNA to the mixer. Traces are provided on the PCB to evaluate the LNA and mixer
separately. The component placement view shows external circuit components used in the 881.5 MHz application circuit. It is necessary to cut a section
in the trace before placing the 0.9 pF capacitor. Capacitors should be 0805 size; the 6.8 nH inductor is a Toko type LL2012.
91 p
100 n
MC13141D
1000 p 470 nH
10 p
83.161 MHz
Saw Filter
0
16 p
100 p
0.9 p
6.8 nH
PC
Rotary
SW
MC13141
MOTOROLA ANALOG IC DEVICE DATA 7
Input Matching/Components
It is desirable to use a RF ceramic or SAW filter before
the mixer to provide image frequency rejection. The filter is
selected based on cost, size and performance tradeoffs.
Typical RF filters have 3.0 to 5.0 dB insertion loss. The PC
board layout accommodates both ceramic and SAW RF
filters which are offered by various suppliers such as
Siemens, Toko and Murata. Interface matching between the
LNA, RF filter and the mixer will be required. The interface
matching networks shown in the application circuit are
designed for 50 W interfaces.
The LNA is conjugately matched to 50 W input and output
at 3.0 Vdc VCC. 17 dB gain and 1.8 dB noise figure is
typical at 881.5 MHz. The mixer measures 7.0 dB gain and
16 dB noise figure as shown in the application circuit.
Typical insertion loss of the Siemens SAW filter is 3.0 dB.
System Noise Considerations
The block diagram shows the cascaded noise stages of
the MC13141 in the front–end receiver subsystem; it
represents the application circuit. In the cascaded noise
analysis the system noise equation is:
Fsystem = F1 + [(F2 –1)/G1] + [(F3–1)] / [(G1)(G2)]
where:
F1 = the Noise Factor of the MC13142 LNA
G1 = the Gain of the LNA
F2 = the Noise factor of the RF Ceramic Filter
G2 = the Gain of the Ceramic Filter
F3 = the Noise factor of the Mixer
Note: the above terms are defined as linear relationships
and are related to the log form for gain and noise figure by the
following:
F = Log –1 [(NF in dB)/10] and similarly
G = Log –1 [(Gain in dB)/10]
Calculating in terms of gain and noise factor yields the
following:
F1 = 1.51 ; G1 = 50.11
F2 = 1.99 ; G2 = 0.5
F3 = 39.8
Thus, substituting in the equation for subsystem noise
factor:
Fsubsystem = 3.08 ; NFsubsystem = 4.9 dB
Overall Subsystem Gain = 21 dB
Figure 5. Front–End Subsystem Block Diagram for Noise Analysis
G3 = 7.0 dB
NF3 = 16 dB
Seimens
Saw Filter
Noise
Source LNA
Mixer
Local
Oscillator
fLO = 798.339 MHz
1000 p
Gsys = 21 dB
NFsys = 4.9 dB
fRF = 881.5 MHz
G1 = 17 dB
NF1 = 1.8 dB
G2 = –3.0 dB
NF2 = 3.0 dB
10 p
470 nH
NF
Meter
IF Output
fIF = 83.16 MHz
MC13141
8 MOTOROLA ANALOG IC DEVICE DATA
Figure 6. Circuit Side View
LNA
Output
Gnd
Mixer
Input
LO
Input
LNA
Input
MC13141D1 Rev A
NOTES: Critical dimensions are 50 mil centers lead to lead in SO–8 footprint.
Also line widths to labeled ports excluding VCC are 50 mil (0.050 inch).
FR4 PCB, 1/32 inch.
VCC IF
Output
Figure 7. MC13141D1 Rev A – Ground Side View
NOTE: FR4 PCB, 1/32 inch.
LNA
Input
Gnd
VCC
LO
Input
IF
Output
LNA
Output
Mixer
Input
MC13141
MOTOROLA ANALOG IC DEVICE DATA 9
NOTES: Critical dimensions are 50 mil centers lead to lead in SO–14 footprint.
Also line widths to labeled ports excluding VCC are 50 mil (0.050 inch).
FR4 PCB, 1/32 inch.
Figure 8. Circuit Side View
LO
Input
IF
Output
Mix Lin
Cont
Mixer
Input
MC13141D
Rev 0
LNA
Output
VCC
LNA
Input
Figure 9. Ground Side View
LNA In
E2
NOTE: FR4 PCB, 1/32 inch.
LNA
Input
LNA
Output
LO
Input
IF
Output
Mix Lin
Cont
VCC
Mixer
Input
MC13141D
Rev 0
MC13141
10 MOTOROLA ANALOG IC DEVICE DATA
D1 SUFFIX
PLASTIC PACKAGE
CASE 751–05
(SO–8)
ISSUE R
D SUFFIX
PLASTIC PACKAGE
CASE 751A–03
(SO–14)
ISSUE F
OUTLINE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
G
P 7 PL
14 8
1 7
0.25 (0.010) M B M
0.25 (0.010) M T B S A S
–T–
R X 45 F
SEATING
PLANE
D 14 PL K
C
M J
DIM MIN MAX MIN MAX
MILLIMETERS INCHES
A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019

SEATING
PLANE
1
4
8 5
C
K
4X P
0.25 (0.010) M T B S A S
0.25 (0.010) M B M
8X D
R
M
J
X 45


F
–A–
–B–
–T–
DIM MIN MAX
MILLIMETERS
A 4.80 5.00
B 3.80 4.00
C 1.35 1.75
D 0.35 0.49
F 0.40 1.25
G 1.27 BSC
J 0.18 0.25
K 0.10 0.25
M 0 7
P 5.80 6.20
R 0.25 0.50

G
NOTES:
1. DIMENSIONS A AND B ARE DATUMS AND T IS A
DATUM SURFACE.
2. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
3. DIMENSIONS ARE IN MILLIMETER.
4. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
6. DIMENSION D DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
MC13141
MOTOROLA ANALOG IC DEVICE DATA 11
FTB SUFFIX
PLASTIC PACKAGE
CASE 976–01
(Thin QFP)
ISSUE O
OUTLINE DIMENSIONS
DIM MIN MAX MIN MAX
MILLIMETERS INCHES
A 4.000 BSC 0.157 BSC
A1 2.000 BSC 0.079 BSC
B 4.000 BSC 0.157 BSC
B1 2.000 BSC 0.079 BSC
C 1.400 1.600 0.055 0.063
D 0.170 0.270 0.007 0.011
E 1.350 1.450 0.053 0.057
F 0.170 0.230 0.007 0.009
G 0.650 BSC 0.026 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.500 0.700 0.020 0.028
M 12 REF 12 REF
N 0.090 0.160 0.004 0.006
P 0.250 BSC 0.010 BSC
Q 1 5 1 5
R 0.150 0.250 0.006 0.010
S 6.000 BSC 0.236 BSC
S1 3.000 BSC 0.118 BSC
V 6.000 BSC 0.236 BSC
V1 3.000 BSC 0.118 BSC
W 0.200 REF 0.008 REF
X 1.000 REF 0.039 REF
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4 DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5 DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8 MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9 EXACT SHAPE OF EACH CORNER IS OPTIONAL.


DETAIL AD
DETAIL Y
4X
4X
1
5
6
11
16
10
15
20
S
S1
A
A1
–U–
0.200 (0.008) AB T–U Z
9
B
B1
–T–
V
V1
–Z–
0.200 (0.008) AB T–U Z
–AC–
–AB–
0.080 (0.003) AC
R
DETAIL AD
DETAIL Y
AE AE
K
X
W
G
TOP & BOTTOM
SECTION AE–AE
M
Q


C E
H
0.250 (0.010)
GAUGE
PLANE
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÇÇÇ
ÇÇÇ
F
D
J N
–T–, –U–, –Z–
0.080 (0.003) S AC T–U S Z S
How to reach us:
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MC13141/D

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